装备名称 Equipment Name

槽式碱抛光洗濯装备  Batch-type Alkaline Polishing Equipment

装备型号 Equipment Model

SC-CSZJ9600E-15F

装备用途 Equipment Application

用于扩散后的硅片抛光刻蚀、洗濯处置惩罚，以及搭配双面电池背面制绒、洗濯处置惩罚。
This equipment is used for polishing, etching and cleaning treatment of diffused wafers and also compatible for texturing and cleaning treatment of bifacial solar cells.

工艺流程 Process Flow

预洗濯→抛光→后洗濯(或O3洗濯)→酸洗→预脱水→烘干（供参考）。
Pre-cleaning→Polishing→Post-cleaning/ O3 cleaning→Acid cleaning→Hot water drying→Drying (for reference only)

手艺特点  Features 

1. 产能：400片/批，9600片/小时（210硅片）;480片/批，12000片/小时（182硅片）。

Throughput: 400pcs/batch,9600pcs/h(210 wafer),480pcs/batch,12000pcs/h(182 wafer).

2. 兼容背面刻蚀抛光及单晶背面制绒工艺。
Compatible with rear side etch polishing and mono-crystalline rear side texturing process.

3. 支持多种添加剂手艺。
Suitable for various additives.

4. 支持最薄120um硅片。
Wafer thickness handling capability up to 120μm.

5. 清洁区域干燥，自清洁系统。
With dry clean area and self-cleaning system.

6. 快速换液，在线换液。
Quick inline bath change.

7. 支持MES、RFID及选配在线称重功效。
Suitable with MES, RFID system, inline weight testing optional.

装备参数 Parameters